# Advanced Packaging MOC ## Core Thesis [[Advanced Packaging Investment Thesis 2026]] ## Technical Foundations 1. [[What Is Advanced Packaging]] 2. [[Why Advanced Packaging Matters Now]] 3. [[CoWoS and 2.5D Packaging]] 4. [[Chiplets and Heterogeneous Integration]] 5. [[HBM and Package Integration]] ## Value Chain & Players 1. [[OSATs - Outsourced Semiconductor Assembly and Test]] 2. [[Advanced Packaging Equipment]] 3. [[Packaging vs Foundry Economics]] ## Investment Mechanics 1. [[Packaging Capacity Bottleneck]] 2. [[OSAT Value Investing Framework]] 3. [[Equipment Tools Cyclicality]] 4. [[Concentrated Packaging Portfolio]] ## Company Analysis 1. [[Amkor - AMKR]] 2. [[ASE Technology - ASX]] 3. [[Kulicke & Soffa - KLIC]] 4. [[BESI - Hybrid Bonding Leader]] ## Related Frameworks - [[Moore's Law]] - [[Wright’s Law]] - [[The infrastructure layer and AI capex]] - [[AI Capex Super-Cycle]] - [[Bill Ackman]] - [[First Principles and Mental Models MoC]] - [[Investing Principles]] --- #investing #semiconductors #deeptech #kp