Chiplets are small, specialized dies that get assembled into one package to act like a single large chip. Why chiplets work: [[Moore's Law]] economics. Making one giant monolithic die is expensive and risky (yield drops exponentially with area). Breaking it into smaller chiplets improves yield, lets you mix different process nodes, and enables modular design. Example: AMD's CPUs use chiplets for compute cores plus a separate I/O die. AI accelerators combine logic chiplets with [[HBM]] memory stacks. The shift to chiplets makes [[What Is Advanced Packaging|Advanced Packaging]] essential. You need dense interconnects (through [[CoWoS and 2.5D Packaging]] or hybrid bonding) to stitch chiplets together without killing performance. Heterogeneous integration means combining dies from different processes or even different foundries in one package. This is the next frontier, not just shrinking transistors. [[Packaging Capacity Bottleneck]] becomes the limiting factor because assembling chiplet-based systems requires advanced tools and techniques that take time to scale. Links: [[Advanced Packaging MOC]], [[Why Advanced Packaging Matters Now]], [[HBM and Package Integration]] --- #semiconductors #deeptech